Thermal Conductivity & Diffusivity

Heat Flow Meter Thermal Conductivity Analyzer

The instrument measures thermal conductivity and thermal resistance by a heat-flow-meter method across low- and high-conductivity ranges. It supports ceramics, glass, refractories, polymers, plastics, rubber, resins, insulation, and other materials with automatic pressure and thickness measurement.

Model
HDRX-II-RL
Category
Thermal Conductivity & Diffusivity

Product Description

The specimen is tested between temperature-controlled plates with selectable pressure. An imported heat-flow sensor measures heat flow; the system can perform thermal conductivity, thermal resistance, and contact thermal resistance tests, including multilayer thin-film measurements.

Key parameters include low- and high-conductivity ranges, temperature limits, sensor, pressure, thickness, vacuum, environmental conditions, and Windows 10 software support.

Technical Specifications

ParameterSpecification
Referenced standardsASTM D5470; ASTM C518-04; GB 10295-2008; GB/T 25261-2018
Low-conductivity range0.00100–5 W/(m·K)
High-conductivity range3–500 W/(m·K); displayed to five decimal places
Resolution0.01 mW/(m·K)
Thermal resistance range0.000005–0.05 m²·K/W
Heat-flow sensorImported sensor; sensitivity better than 17 μV·W/m²; Ø30 mm
Cold-plate temperature0.00–99.99 °C; 0.01 °C resolution
Hot-plate temperatureRoom temperature +10–1,000 °C; stability 0.1 °C
Specimen sizesØ50 × (5–40) mm; 50 × 50 × (5–40) mm; high-temperature thickness 30–40 mm
Applied loadMaximum 1,000 N; 0.1 N resolution; servo or stepper control
ThicknessMaximum 50 mm; 1 μm resolution
Ambient conditions−5 to 40 °C; 0–95% relative humidity
Power supplyAC 220 V; 50 Hz
SoftwareAutomated thermal-analysis software; Chinese/English interface; Windows 10
Test modesThermal conductivity at different pressures; thermal resistance at different pressures; contact thermal resistance

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