WQY Thermal Bimetal Bending Test System

Published December 15, 2017

1 min read

The WQY thermal bimetal bending test system is designed in accordance with GB/T 8364-2008, Method for Measuring the Bending Constant of Thermal Bimetal. It measures specific bending, thermal curvature...

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The WQY thermal bimetal bending test system is designed in accordance with GB/T 8364-2008, Method for Measuring the Bending Constant of Thermal Bimetal. It measures specific bending, thermal curvature, and bending constants of thermal bimetals and is primarily used for thermophysical performance testing of raw materials in safety devices and automatic temperature controllers for household appliances. Building on the base standard, the system extends functionality to include thermal-bending tests at constant pressure and thermal-pressure tests at constant displacement.

The instrument uses the cantilever-beam method. A closed loop is formed by the specimen, specimen clamp, displacement measuring rod, displacement sensor, and pressure sensor. Because thermal-bimetal curvature varies with temperature, the system quantifies free-end displacement and deflection by controlling the contact pressure between the specimen and the displacement measuring rod.

Key technical specifications: - Maximum temperature: 300 °C; temperature-control resolution: 0.1 °C - Displacement sensor: 0–5 cm; resolution: 0.01 mm - Specimen size: 10 × 100 × 1 mm (customizable) - Configuration: complete test system and software platform

Automated analysis software provides parameter analysis and report output. The system supports output of: - (7a) Displacement–temperature curves in the free state - Displacement–temperature curves at fixed pressure - Pressure–temperature curves at fixed displacement

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