Heat Flow Meter Thermal Conductivity Analyzer
The instrument uses the heat flow meter method to measure thermal conductivity, with separate thermal-resistance and thermal-contact-resistance test modes. It accepts small specimens of polymers, ceramics, insulation, composites, glass, rubber, and other low- to medium-conductivity materials, including multilayer films.
- Model
- DRX-II-RL
- Category
- Thermal Conductivity & Diffusivity
Product Description
The instrument uses motor-controlled plate movement and clamps the specimen between two heat flow sensors. The temperature gradient can be fixed or adjustable. An embedded controller or external computer measures thermal conductivity and thermal resistance; automatic upper-plate movement and specimen-thickness measurement are provided, and test parameters and calibration data can be stored on the computer. The instrument references MIL-I-49456 A, D5470-06, ASTM E1530, ASTM C518, ISO 8301, JIS A 1412, DIN EN 12939, DIN EN 13163, and DIN EN 12667.
The instrument provides four test modes: thermal resistance under different specimen loads, thermal conductivity, thermal contact resistance, and aging reliability. Small specimens can be used, and films can be measured using a multilayer technique. Listed materials are polymers, ceramics, insulation, composites, nonmetals, glass, rubber, and other low- to medium-conductivity materials.
Technical Specifications
| Parameter | Specification |
|---|---|
| Hot plate temperature control | Room temperature to 200 °C; resolution 0.01 °C |
| Cold plate temperature control | 0–99.99 °C; resolution 0.01 °C |
| Sample diameter | 10–50 mm; maximum Ø50 mm or 50 × 50 mm |
| Sample thickness | 0.1–40 mm |
| Thermal resistance range | 0.000005–0.05 m²·K/W |
| Thermal conductivity range | 0.010–50 W/(m·K) |
| Specimen clamping-force range | 0–1,000 N |
| Displacement measurement range | 0–50.00 mm |
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